Today’s advanced packaging technology relies on progressive course of techniques to provide improved IC part performance and multi-function integration. To forestall faulty units from shifting ahead in the supply chain, screening and sorting are necessary quality control steps for packaged IC components, IC substrates and printed circuit boards . Inspection and metrology systems capture critical defects and variations for the continuous enchancment of packaging and PCB processes, reliability-related issues and system failure traceability. SolutionsAutomotive Navigation, infotainment, driver assistance, autonomous driving, flying cars!
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